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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
Temperature Sensor Thermo String Type Speci?cations and Test Methods
R44E.pdf
Dec.17,2012
No.
1
2
3
Item
High Temperature
Storage Test
Low Temperature
Storage Test
Humidity
Storage Test
Specifications
· Resistance (R25°C) fluctuation rate: less than ±1%.
· B-Constant (B25/50°C) fluctuation rate: less than ±1%.
Test Methods
125±2°C in air, for 1000 +48/-0 hours without loading.
-40 +0/-3°C in air, for 1000 +48/-0 hours without loading.
60±2°C, 90 to 95%RH in air, for 1000 +48/-0 hours without
loading.
-40 +0/-3°C, 30 minutes in air
4
Temperature
Cycle
· Resistance (R25°C) fluctuation rate: less than ±2%.
· B-Constant (B25/50°C) fluctuation rate: less than ±1%.
+25±2°C, 10 to 15 minutes in air
+125±2°C, 30 minutes in air
+ 25 +2/-0°C, 10 to 15 minutes in air (1 cycle)
Continuous 100 cycles, without loading.
5
High Temperature
Load
85±2°C in air, with 'Operating Current for Sensor' for 1000
+48/-0 hrs.
6
Insulation Break -
down Voltage
· No damage electrical characteristics at DC100 V, 1 min.
2mm length of coating resin from the top of Thermistor is to be
dipped into beads of lead (Pb), and DC100V 1 minute is
applied to circuit between beads of lead (Pb) and lead wire.
Both lead wires are dipped into 350±10°C solder for 3.5±0.5
seconds, or 260±5°C solder for 10±1 seconds according to
Fig-1 (solder <JIS Z 3282 H60A>).
5
7
Resistance to
Soldering Heat
· Resistance (R25°C) fluctuation rate: less than ±1%.
· B-Constant (B25/50°C) fluctuation rate: less than ±1%.
1 to 2mm
Solder
Fig-1
Both lead wires are dipped into flux (25wt% colophony <JIS K
8
Solderability
More than 90% of lead wire surface shall be covered by solder.
5902> isopropyl alcohol <JIS K 8839>) for 5 to 10 seconds.
Then both lead wires are dipped into 235±5°C solder
<JIS Z 3282 H60A> for 2±0.5 seconds according to Fig-1.
The lead wire shall be inserted in a ?1.0mm hole until resin part
contacts with a substrate as shown in fig.-2, and 1N force for 10
seconds shall be applied to the lead wire.
9
10
Lead Wire
Pull Strength
Lead Wire
Bending Strength
· Resistance (R25°C) fluctuation rate: less than ±1%.
· B-Constant (B25/50°C) fluctuation rate: less than ±1%.
· Lead wire does not break.
1N (10 sec.)
Fig-2
Hold the lead wires as in Fig-3. Bend by 90 degrees and again
bend back to the initial position. Then bend to the other side by
90 degrees and again bend back to the initial position. After
bending process, 10N force for 3 seconds shall be applied to
the lead wire.
10N (3 sec.)
Fig-3
* · R25 is zero-power resistance at 25°C.
· B25/50 is calculated by zero-power resistance of Thermistor in 25°C -50°C.
· After each test, NTC Thermistor should be kept for 1 hour at room temperature (normal humidity and normal atmospheric pressure).
Continued on the following page.
26
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